The GR740-PBGA device is the plastic version of the radiation-hard quad-core fault-tolerant LEON4 SPARC V8 processor targeting space constellations.
The GR740-PBGA has the same functionality, fault-tolerance and radiation-hardness as the GR740 system-on-chip device. Here is more information on the GR740 device
, which is also applicable to the GR740-PBGA except the package information.
The GR740-PBGA has a Plastic Ball Grid Array (PBGA) with 625 ball, being footprint compatible the GR740 Ceramic Column Grid Array (CCGA), featuring the same pinout and 1mm pitch.
The GR740-PBGA is made available in to quality and temperature ranges:
- GR740-CP-PBGA625 - prototype quality, commercial temperature range
- GR740-AS-PBGA625 - flight quality (ESCC-Q-60-13C class 2), automotive temperature range -40C to +105C
- Prototypes are currently undergoing internal evaluation
- Prototypes planned to be available for sale and delivery in Q2 2021
- Flight parts planned to be available for sale and delivery in Q4 2021
- System frequency: 250 MHz
- Main memory interface: PC100 SDRAM
- SpaceWire router with SpaceWire links 200 Mbit/s minimum
- 33 MHz PCI 2.3 initiator/target interface
- Ethernet 10/100/1000 Mbit MACs
- PBGA625 package
The GR740-PBGA device is targeted at high-performance general purpose processing on satellite constellations. The architecture is suitable for both symmetric and asymmetric multiprocessing. Shared resources can be monitored to support mixed-criticality applications.
Quad-Core LEON4 Next Generation Microprocessor Development Board
The GR-CPCI-GR740 evaluation board has been designed for evaluation of the GR740 device (using the GR740 LGA625 component):