The GR716B is a radiation-hardened microcontroller featuring the fault-tolerant LEON3 SPARC V8 processor. Based on the GR716A design, the GR716B has been developed to provide a more advanced SoC with higher computational performance and excellent communication interfaces.

The GR716B is currently under development and prototypes will be available in 2023.

Specification

• System frequency up-to 100 MHz
• SpaceWire links up-to 200 Mbps
• CQFP132 hermetically sealed ceramic package
• Total Ionizing Dose (TID) up to 300 krad (Si)
• Single-Event Latch-up Immunity (SEL) to LETTH > 118 MeV-cm2mg
• Single-Event Upset (SEU) below TBD errors per device and day in space environment
• Support for single 3.3V supply

Features

• Fault-tolerant  LEON3 SPARC V8 processor
  
  • 16-bit instruction set: LEON-REX for improved code density
  • Double precision IEEE-754 pipelined floating point unit
  • Memory protection units
    
  • Deterministic software execution and non-intrusive debugging
  • Fast context switching (PWRPSR, AWP, register partitioning, interrupt mapping, SVT, MVT) 
  • Interrupt zero jitter delay
• 2x Real Time Accelerator (RTA)
  
  • Offload the main LEON3 for simple tasks
• Non-intrusive advanced on-chip debug support unit
  
• External EDAC protected 8-bit PROM/SRAM memory
• SPI memory protected by EDAC and dual memory redundancy
• Power-on-Reset and Brown-out-detection
• FPGA supervisor for FPGA programming and scrubbing
  • Can target Xilinx Virtex5 and Kintex UltraScale
• Programmable PWM interface with Analog/Digital Voltage
  control and motor control loop support
• Programmable pulse-width-modulation DAC
• On-chip Boot ROM for low-level initialization and optional self-testing, standby and application loading
• Remote boot through SpaceWire RMAP, CANOpen, SPI slave or UART
• Enhanced DMA controller
• Timers with Watchdog

Interfaces

• 2-Port SpaceWire Router with time distribution support, 200 Mbps max bitrate
  • LVDS with extended common-mode,  Cold-Spare and Fail-Safe support
• 10/100 Mbit/s Ethernet
• MIL-STD-1553B interface
• CAN-FD controller interface with CANopen support for remote boot
• PacketWire with CRC acceleration support
• Programmable Enhanced PWM with analog/digital voltage control loop support
• SPI with SPI-for-Space protocols
• UARTs, I2C, GPIO
  
• Mixed General purpose inputs and outputs

Integrated Analog functions

• 4x Rad-Hard ADC 13bits resolution @ 500Ksps, 8 differential or 16 single-ended channels
• Rad-Hard DAC 12bits @ 3Msps, 4 channels
• 20x Analogue voltage comparator
• Rad Hard PLL
• Crystal Oscillator
• Power-on-Reset and Brown-out-detection
• 1.8V and 3.3V voltage monitors
• LVDS transceivers with build-in reference
• Rad Hardened voltage and current reference
• Rad Hardened Low-drop regulators for single supply support
• Rad Hardened external voltage references
• Temperature sensor, Integrated PLL
• On-chip regulator for 3.3V single supply

 Software Development Environment (SDE)

We provide compiler toolchains and development tools with GR716B-specific support such as the GR716B BSPs, GRMON support and simulator CPU/IO models. The Bare-metal environment is free and open-source. The GR716-MINI board can be evaluated using the free GRMON3 evaluation version.

Our SDE for the GR716 consists of the following software components:

• BCC2 Bare-metal C/C++ GCC/LLVM toolchain environment
• GRMON3 hardware debugger
• TSIM3 GR716 instruction simulator

Memory support

• 192KiB EDAC protected tightly coupled memory with single cycle access from processor and ATOMIC bit operations
• Embedded ROM with bootloader for initializing and remote access
• Dedicated SPI Memory interface with boot ROM capability
• 8-bit SRAM/ROM I/F with support up to 16MiB ROM and 256MiB SRAM
• Scrubber with programmable scrub rate for all embedded memories and external PROM/SRAM and SPI memories
• Redundant boot memory (PROM/SRAM/SPI/I2C/NVRAM)
• Application software container for checking software integrity using CRC
• Boot from internal SRAM, external PROM/FLASH/SRAM/SPI/I2C memory